IR Vacuum Reflow

Table Top System


  • Temperature: 450°C, up to 750°C
  • Heated area: 230 x 217 mm
  • Fast heated plate ramping:
    - Ramping up > 3.5°C/second
    - Ramping down > 2°C/second
  • Rapid single wafer processing > 20°C/second
  • 100 steps per program
  • Oxygen < 1,0 ppm
  • Formic acid activated nitrogen
  • Ultimate Vacuum: ~ 5 x 10-5 mbar
  • Flux less, with flux and solder paste



The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose “cold wall” process ovens. The SRO is ideal for R&D and process development.



Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells.