Manual Die Mounter - Micro-Manipulator System


The Micro-Manipulator System with its diferent work heads is a versatile piece of equipment which lends itself to a wide range of applications in microelectronics. It is useful not only in servicing and in the laboratory, but also in small-batch production. It readily converts into a die mounter, a destruct or high-speed non destruct pull-tester (wire bond tester), a repair station or a checking and trimming tool.


Key features:

  • Microscope based manual die bonder/dispenser
  • Component/SMD placer, epoxy/solder paste dispenser
  • Wire bond pull tester, resistor trimmer, probe station
  • Epoxy curing, die removal and eutectic die bonder